 |
BGA
Ball Grid Array |
|
EBGA 680L |
|
LBGA 160L |
|
PBGA 217L
Plastic Ball
Grid
Array |
|
SBGA 192L |
|
TSBGA 680L |
|
CLCC |
|
CNR Communication and Networking
Riser Specification Revision 1.2 |
|
CPGA Ceramic Pin Grid Array |
|
DIP Dual Inline Package |
|
DIP-tab Dual Inline Package with
Metal Heatsink |
|
FBGA |
|
FDIP |
|
FTO-220 |
|
Flat Pack |
|
HSOP-28 |
|
ITO-220 |
|
ITO-3P |
|
JLCC |
|
LCC |
|
LDCC |
|
LGA |
 |
LQFP |
 |
PCDIP |
|
PGA Plastic Pin Grid Array |
|
PLCC |
|
PQFP |
|
PSDIP |
|
LQFP 100L |
|
METAL QUAD 100L |
|
PQFP 100L |
|
QFP Quad Flat
Package |
|
SOT143 |
|
SOT220 |
|
SOT223 |
|
SOT223 |
|
SOT23 |
|
SOT23/SOT323 |
|
SOT25/SOT353 |
|
SOT26/SOT363 |
|
SOT343 |
|
SOT523 |
|
SOT89 |
|
SOT89 |
|
Socket 603 Foster |
|
LAMINATE TCSP 20L Chip Scale
Package |
|
TO252 |
|
TO263/TO268 |
|
QFP Quad Flat Package |
|
TQFP 100L |
|
SBGA |
|
SC-70 5L |
|
SDIP |
|
SIP Single Inline Package |
|
SO Small Outline Package |
|
SOJ 32L |
|
SOJ |
|
SOP EIAJ TYPE II 14L |
|
SOT220 |
|
SSOP 16L |
|
TO247 |
|
SSOP |
|
TO18 |
|
TO220 |
|
TO264 |
|
TO3 |
|
TO5 |
|
TO52 |
|
TO71 |
|
TO72 |
|
TO78 |
|
TO8 |
|
TO92 |
|
TO93 |
|
TO99 |
|
TSOP Thin Small Outline
Package |
|
TSSOP or TSOP II Thin Shrink
Outline Package |
|
uBGA Micro Ball Grid
Array |
|
uBGA Micro Ball Grid Array |
|
ZIP Zig-Zag Inline
Package |
|
BQFP132 |
|
C-Bend Lead |
|
CERQUAD Ceramic Quad Flat Pack |
|
Ceramic Case |
|
LAMINATE CSP 112L Chip Scale
Package |
|
Gull Wing Leads |
|
PDIP |
|
PLCC |
|
SNAPTK |
|
SNAPTK |
封装形式图解
